Class 3, Lab 2. This course covers the manufacture and assembly of
electronic printed circuit boards from component selection and board
layout to soldering and test. Special emphasis is placed on high volume
manufacturing techniques and state-of-the-art processes, such as surface

mount technology (SMT). Laboratory projects include CAD circuit board
layout, using automatic placement and soldering equipment, investigating

thermal characteristics of circuit boards, process design, and
evaluation using SPC techniques. Effects of manufacturing processes on
electrical characteristics are considered.