Class 3, Lab 2. P: EET 204. Manufacture and assembly of electronic
printed circuit boards, from component selection and board layout to
soldering and testing. Special emphasis on high-volume manufacturing
techniques and state-of-the-art processes, such as surface-mount
technology (SMT). Laboratory projects include CAD circuit board layout,
using automatic placement and soldering equipment, investigating thermal

characteristics of circuit boards, process design and evaluation using
SPC techniques. Effects of manufacturing processes on electrical
characteristics are considered.